Isolated 485 Chip, Building "Network Communication" for 
Home Photovoltaic, Energy Storage, and Charging Systems 

With the continuous advancement of technology, smart homes, as a prime example of the integration of modern IoT technology into daily life, are gradually permeating people’s lives and demonstrating vigorous growth. Through the close interconnection and collaboration among smart devices, smart homes provide consumers with a more convenient, comfortable, secure, and harmonious living environment.  

Currently, smart homes are evolving toward greater human-centricity, digital intelligence, and low-carbon practices. In this process, various networking and communication technologies—such as 5G, NB-IoT, Sub-GHz, BLE, Wi-Fi, Zigbee, and LoRa—play a vital role. These technologies not only connect diverse smart devices but also transmit data signals and facilitate information exchange. They work synergistically to ensure the efficient operation of smart home systems.  

In smart home systems, networking communication technologies act like the "neural network" of the human body, ensuring seamless connectivity among devices. Their performance and quality directly impact the system’s stability and user experience.  

HOPERF, a domestic wireless communication system-on-chip (SoC) manufacturer deeply rooted in China’s IoT industry for years, offers wafer-level customization services. For the smart home sector, HOPERF provides a diverse range of products, including Sub-GHz chips/modules, BLE chips/modules, Matter modules, Wi-SUN modules, LoRa modules, and isolated interface chips.  

Among these, HOPERF’s isolated interface chips (485/CAN) adopt mainstream capacitive isolation solutions. These "RF chips" utilize OOK modulation technology to transmit signals via changes in the internal electric field of capacitors. HOPERF’s isolated interface chips (485/CAN) have been widely implemented in smart home applications, such as:  

·Home Photovoltaic Systems: Through isolated interfaces, the control unit (MCU) not only transmits data collected by sampling modules to external devices/networks but also relays control commands from external devices to internal components, enabling tight coordination among photovoltaic system elements.  

·Home Energy Storage Systems: Via isolated interfaces, the Battery Management System (BMS) can provide real-time feedback on voltage, current, and temperature status of energy storage batteries to external devices/networks while conveying external control commands internally.  

·Home Charging Pile Systems: Using isolated interfaces, stable and secure data exchange and command transmission are achieved between charging piles and electric vehicles, among internal control units within charging piles, and between charging piles and the grid.  

·Home Smart Meter Systems: Isolated interfaces ensure accurate and stable data transmission between the control unit (MCU) and data buses, the MCU and metering modules, and display driver circuits and main control circuits.  

·Home Lighting Control Systems: Through isolated interfaces, the control unit (MCU) can exchange data with other smart devices, enabling remote control of lighting systems.  

·Home Environmental Monitoring Systems: Isolated interfaces allow environmental sensors to transmit collected data to the MCU, facilitating real-time monitoring of environmental parameters.  

·Home Security Systems: Isolated interfaces ensure stable transmission of video and data from surveillance cameras and intrusion detection systems, enabling remote monitoring and real-time alerts.  

Additionally, HOPERF’s isolated interface chips offer advantages such as transmission speeds exceeding 1MHz (up to 12MHz), isolation voltage over 3.75kV, CMTI exceeding 150kV/μs, surge resistance above 8kVpk, and a wider operating temperature range. These features effectively address electrical interference, signal attenuation, and data leakage in home environments, ensuring data accuracy, stability, and protection of consumer privacy and property.  

Currently, HOPERF’s isolated interface chip series include three categories: CMT810X (I2C), CMT10XX (CAN), and CMT8308X (485). Operating at 2.5V–5.5V, these chips support multiple package types (DUB8, SOW8, SOP8, SOW16) and are pin-to-pin compatible with mainstream products. They reduce chip size, lower power consumption, and enhance the portability and long-term performance of smart home devices.