From November 26th to 28th, 2025 , the annual IoT extravaganza – AIoT Korea Exhibition 2025 – hosted by the Ministry of Science and ICT of Korea and organized by the Intelligent IoT Association and K. Fairs, Ltd., successfully concluded at Hall D, 3rd Floor, COEX Convention Center in Seoul!
The conference, themed "모두의AI, IoT로실현되는일상의지능화" (Connecting the World, Empowering Everyday Life) , is the only professional smart IoT exhibition in South Korea. It brings together more than 150 leading IoT companies from around the world and is one of the most influential events in the South Korean IoT industry .
Among them, HOPERF, as an IoT chip manufacturer integrating "chip design, testing and development and manufacturing" in the upstream of the wireless communication industry chain, participated in the exhibition with its latest IoT R&D achievements such as self-developed Sub-GHz, Matter, BLE and Isolator chips/modules (booth number: F133). The aim is to enhance the company's cooperation and collaboration capabilities with downstream companies in the global industry chain. At the same time, it also hopes to have in-depth technical discussions and exchanges of ideas with IoT elites from all over the world, and jointly contribute to the vigorous development of the AIoT industry.
HOPERF booth ( F133 ) on site
At the exhibition, HOPERF showcased its full range of IoT chips/modules and related solutions to the visitors. Among them, the Sub-GHz radio frequency transceiver chip/module is a wireless transceiver product with basic radio frequency transmission and reception capabilities. It can fully release the flexibility of protocol design to meet the technical needs of specific IoT applications and is an excellent solution for deploying large-scale IoT networks.
The Matter module is an interconnected product developed based on the Matter protocol. It can break down communication barriers between smart home devices of different brands and ecosystems, and achieve seamless linkage and data interaction between devices across platforms and manufacturers. It is a key solution to promote the unified and convenient deployment of the smart home industry ecosystem.
BLE chips/modules are wireless connectivity products that integrate Bluetooth Low Energy communication protocol stacks and radio frequency functions. They can significantly optimize the communication power consumption of devices and are perfectly adapted to short-range, low-speed, and low-power IoT application scenarios. They are one of the mainstream solutions for achieving lightweight and low-cost wireless connectivity for IoT terminal devices at present.
It is worth mentioning that during the exhibition, HOPERF's selected exhibits not only attracted a large number of professional visitors to stop and inquire, but also, after in-depth exchanges with HOPERF's senior technical engineering team, they not only gained a clear understanding of the core performance advantages of these exhibits and the potential for the implementation of low-power IoT wireless communication solutions, but also found practical and feasible cooperation directions for the technical upgrade of their own businesses.
The 2025 Korea AIoT International Exhibition has successfully concluded. After this experience, HOPERF firmly believes that as long as it continues to uphold the core development philosophy of "innovation, excellence, and win-win", focuses on its core business, remains undistracted by the chip industry, and actively develops new quality productivity, it will surely be able to showcase the dazzling brilliance of China's Internet of Things on the international stage in the future.
